WebCPC CPC COOPERATIVE PATENT CLASSIFICATION

H01C　RESISTORS

H01C 1/00 Details

H01C 1/01 ・Mounting; Supporting

H01C 1/012 ・・the base extending along and imparting rigidity or reinforcement to the resistive element (H01C 1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C 3/18, H01C 3/20; the resistive element being formed as one or more layers or coatings on a base H01C 7/00)

H01C 1/014 ・・the resistor being suspended between and being supported by two supporting sections (H01C 1/016 takes precedence)

H01C 1/016 ・・with compensation for resistor expansion or contraction

H01C 1/02 ・Housing; Enclosing; Embedding; Filling the housing or enclosure

H01C 1/022 ・・the housing or enclosure being openable or separable from the resistive element

H01C 1/024 ・・the housing or enclosure being hermetically sealed (H01C 1/028, H01C 1/032, H01C 1/034 take precedence)

H01C 1/026 ・・・with gaseous or vacuum spacing between the resistive element and the housing or casing

H01C 1/028 ・・the resistive element being embedded in insulation with outer enclosing sheath

H01C 1/03 ・・・with powdered insulation

H01C 1/032 ・・plural layers surrounding the resistive element (H01C 1/028 takes precedence)

H01C 1/034 ・・the housing or enclosure being formed as coating or mold without outer sheath (H01C 1/032 takes precedence)

H01C 1/036 ・・・on wound resistive element

H01C 1/04 ・Arrangements of distinguishing marks, e.g. colour coding

H01C 1/06 ・Electrostatic or electromagnetic shielding arrangements

H01C 1/08 ・Cooling, heating or ventilating arrangements

H01C 1/082 ・・using forced fluid flow

H01C 1/084 ・・using self-cooling, e.g. fins, heat sinks

H01C 1/12 ・Arrangements of current collectors

H01C 1/125 ・・of fluid contacts

H01C 1/14 ・Terminals or tapping points {or electrodes} specially adapted for resistors (in general H01R); Arrangements of terminals or tapping points {or electrodes} on resistors

H01C 1/1406 ・・{Terminals or electrodes formed on resistive elements having positive temperature coefficient}

H01C 1/1413 ・・{Terminals or electrodes formed on resistive elements having negative temperature coefficient}

H01C 1/142 ・・the terminals or tapping points being coated on the resistive element

H01C 1/144 ・・the terminals or tapping points being welded or soldered

H01C 1/146 ・・the resistive element surrounding the terminal

H01C 1/148 ・・the terminals embracing or surrounding the resistive element (H01C 1/142 takes precedence)

H01C 1/16 ・Resistor networks not otherwise provided for

H01C 3/00 Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids

H01C 3/005 ・{Metallic glasses therefor}

H01C 3/02 ・arranged or constructed for reducing self-induction, capacitance or variation with frequency

H01C 3/04 ・Iron-filament ballast resistors; Other resistors having variable temperature coefficient

H01C 3/06 ・Flexible or folding resistors, whereby such a resistor can be looped or collapsed upon itself

H01C 3/08 ・Dimension or characteristic of resistive element changing gradually or in discrete steps from one terminal to another

H01C 3/10 ・the resistive element having zig-zag or sinusoidal configuration

H01C 3/12 ・・Lying in one plane

H01C 3/14 ・the resistive element being formed in two or more coils or loops continuously wound as a spiral, helical or toroidal winding (H01C 3/02 to H01C 3/12 take precedence)

H01C 3/16 ・・including two or more distinct wound elements or two or more winding patterns

H01C 3/18 ・・wound on a flat or ribbon base (H01C 3/16 takes precedence)

H01C 3/20 ・・wound on cylindrical or prismatic base (H01C 3/16 takes precedence)

H01C 7/00 Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material (consisting of loose powdered or granular material H01C 8/00; {measuring deformation in a solid state using the change in resistance formed by printed-circuit technique G01B 7/20; insulating materials H01B 3/00; passive thin-film or thick-film semiconductor or solid state devices H01L 27/00; resistors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor H01L 28/20}; resistors with a potential-jump barrier or surface barrier, e.g. field effect resistors H01L 29/00; semiconductor devices sensitive to electro-magnetic or corpuscular radiation, e.g. photoresistors, H01L 31/00; devices using superconductivity H01L 39/00; devices using galvanomagnetic or similar magnetic effects, e.g. magnetic-field-controlled resistors, H01L 43/00; solid state devices for rectifying, amplifying, oscillating or switching without a potential-jump barrier or surface barrier H01L 45/00; bulk negative resistance effect devices H01L 47/00; {ohmic resistance heating H05B 3/00; printed circuits H05K}) [m1112]

H01C 7/001 ・{Mass resistors}

H01C 7/003 ・{Thick film resistors}

H01C 7/005 ・・{Polymer thick films}

H01C 7/006 ・{Thin film resistors}

H01C 7/008 ・{Thermistors (H01C 7/02 to H01C 7/06 take precedence)}

H01C 7/02 ・having positive temperature coefficient {(ceramics C04B)}

H01C 7/021 ・・{formed as one or more layers or coatings}

H01C 7/022 ・・{mainly consisting of non-metallic substances (H01C 7/021 takes precedence)}

H01C 7/023 ・・・{containing oxides or oxidic compounds, e.g. ferrites}

H01C 7/025 ・・・・{Perowskites, e.g. titanates}

H01C 7/026 ・・・・{Vanadium oxides or oxidic compounds, e.g. VOx}

H01C 7/027 ・・{consisting of conducting or semi-conducting material dispersed in a non-conductive organic material}

H01C 7/028 ・・{consisting of organic substances}

H01C 7/04 ・having negative temperature coefficient {(thermometers using resistive elements G01K 7/16)}

H01C 7/041 ・・{formed as one or more layers or coatings}

H01C 7/042 ・・{mainly consisting of inorganic non-metallic substances (H01C 7/041 takes precedence)}

H01C 7/043 ・・・{Oxides or oxidic compounds}

H01C 7/044 ・・・・{Zinc or cadmium oxide}

H01C 7/045 ・・・・{Perowskites, e.g. titanates}

H01C 7/046 ・・・・{Iron oxides or ferrites}

H01C 7/047 ・・・・{Vanadium oxides or oxidic compounds, e.g. VOx}

H01C 7/048 ・・・{Carbon or carbides}

H01C 7/049 ・・{mainly consisting of organic or organo-metal substances (H01C 7/041 takes precedence)}

H01C 7/06 ・including means to minimise changes in resistance with changes in temperature

H01C 7/10 ・voltage responsive, i.e. varistors

H01C 7/1006 ・・{Thick film varistors}

H01C 7/1013 ・・{Thin film varistors}

H01C 7/102 ・・Varistor boundary, e.g. surface layers (H01C 7/12 takes precedence)

H01C 7/105 ・・Varistor cores (H01C 7/12 takes precedence)

H01C 7/108 ・・・Metal oxide

H01C 7/112 ・・・・ZnO type

H01C 7/115 ・・・・Titanium dioxide- or titanate type

H01C 7/118 ・・・Carbide, e.g. SiC type

H01C 7/12 ・・Overvoltage protection resistors {(series resistors structurally associated with spark gaps H01T 1/16)}

H01C 7/123 ・・・{Arrangements for improving potential distribution}

H01C 7/126 ・・・{Means for protecting against excessive pressure or for disconnecting in case of failure}

H01C 7/13 ・current responsive

H01C 7/18 ・comprising a plurality of layers stacked between terminals

H01C 7/20 ・the resistive layer or coating being tapered

H01C 7/22 ・Elongated resistive element being bent or curved, e.g. sinusoidal, helical

H01C 8/00 Non-adjustable resistors consisting of loose powdered or granular conducting, or powdered or granular semi-conducting material

H01C 8/02 ・Coherers or like imperfect resistors for detecting electromagnetic waves

H01C 8/04 ・Overvoltage protection resistors; Arresters

H01C 10/00 Adjustable resistors

H01C 10/005 ・{Surface mountable, e.g. chip trimmer potentiometer}

H01C 10/02 ・Liquid resistors

H01C 10/025 ・・{Electrochemical variable resistors (trimming resistors by electrolytic treatment H01C 17/2412, H01C 17/262)}

H01C 10/04 ・with specified mathematical relationship between movement of resistor actuating means and value of resistance, other than direct proportional relationship

H01C 10/06 ・adjustable by short-circuiting different amounts of the resistive element

H01C 10/08 ・・with intervening conducting structure between the resistive element and the short-circuiting means, e.g. taps

H01C 10/10 ・adjustable by mechanical pressure of force

H01C 10/103 ・・{by using means responding to magnetic or electric fields, e.g. by addition of magnetisable or piezoelectric particles to the resistive material, or by an electromagnetic actuator}

H01C 10/106 ・・{on resistive material dispersed in an elastic material (H01C 10/103 and H01C 10/12 take precedence; for electric switches H01H 1/02B)}

H01C 10/12 ・・by changing surface pressure between resistive masses or resistive and conductive masses, e.g. pile type

H01C 10/14 ・adjustable by auxiliary driving means

H01C 10/16 ・including plural resistive elements

H01C 10/18 ・・including coarse and fine resistive elements

H01C 10/20 ・・Contact structure or movable resistive elements being ganged

H01C 10/22 ・resistive element dimensions changing gradually in one direction, e.g. tapered resistive element (H01C 10/04 takes precedence)

H01C 10/23 ・resistive element dimensions changing in a series of discrete, progressive steps

H01C 10/24 ・the contact moving along turns of a helical resistive element, or vica versa

H01C 10/26 ・resistive element moving (H01C 10/16, H01C 10/24 take precedence)

H01C 10/28 ・the contact rocking or rolling along resistive element or taps

H01C 10/30 ・the contact sliding along resistive element

H01C 10/301 ・・{consisting of a wire wound resistor}

H01C 10/303 ・・・{the resistor being coated, e.g. lubricated, conductive plastic coated, i.e. hybrid potentiometer}

H01C 10/305 ・・{consisting of a thick film}

H01C 10/306 ・・・{Polymer thick film, i.e. PTF}

H01C 10/308 ・・{consisting of a thin film}

H01C 10/32 ・・the contact moving in an arcuate path

H01C 10/34 ・・・the contact or the associated conducting structure riding on collector formed as a ring or portion thereof

H01C 10/345 ・・・・{the collector and resistive track being situated in 2 parallel planes}

H01C 10/36 ・・・structurally combined with switching arrangements

H01C 10/363 ・・・・{by axial movement of the spindle, e.g. pull-push switch (H01C 10/366 takes precedence)}

H01C 10/366 ・・・・{using an electromagnetic actuator}

H01C 10/38 ・・the contact moving along a straight path

H01C 10/40 ・・・screw operated

H01C 10/42 ・・・・the contact bridging and sliding along resistive element and parallel conducting bar or collector

H01C 10/44 ・・・the contact bridging and sliding along resistive element and parallel conducting bar or collector (H01C 10/42 takes precedence)

H01C 10/46 ・Arrangements of fixed resistors with intervening connectors, e.g. taps (H01C 10/28, H01C 10/30 take precedence)

H01C 10/48 ・・including contact movable in an arcuate path

H01C 10/50 ・structurally combined with switching arrangements (H01C 10/36 takes precedence)

H01C 11/00 Non-adjustable liquid resistors

H01C 13/00 Resistors not provided for elsewhere

H01C 13/02 ・Structural combinations of resistors (impedance networks per se H03H)

H01C 17/00 Apparatus or processes specially adapted for manufacturing resistors (providing fillings for housings or enclosures H01C 1/02; reducing insulation surrounding a resistor to powder H01C 1/03; manufacture of thermally variable resistors H01C 7/02, H01C 7/04)

H01C 17/003 ・{using lithography, e.g. photolithography (lithographic compositions and processing in general G03F)}

H01C 17/006 ・{adapted for manufacturing resistor chips}

H01C 17/02 ・adapted for manufacturing resistors with envelope or housing

H01C 17/04 ・adapted for winding the resistive element

H01C 17/06 ・adapted for coating resistive material on a base

H01C 17/065 ・・by thick film techniques, e.g. serigraphy

H01C 17/06506 ・・・{Precursor compositions therefor, e.g. pastes, inks, glass frits}

H01C 17/06513 ・・・・{characterised by the resistive component}

H01C 17/0652 ・・・・・{containing carbon or carbides}

H01C 17/06526 ・・・・・{composed of metals}

H01C 17/06533 ・・・・・{composed of oxides}

H01C 17/0654 ・・・・・・{Oxides of the platinum group}

H01C 17/06546 ・・・・・・{Oxides of zinc or cadmium}

H01C 17/06553 ・・・・・{composed of a combination of metals and oxides}

H01C 17/0656 ・・・・・{composed of silicides (H01C 17/0652 takes precedence)}

H01C 17/06566 ・・・・・{composed of borides (H01C 17/0652 takes precedence)}

H01C 17/06573 ・・・・{characterised by the permanent binder}

H01C 17/0658 ・・・・・{composed of inorganic material}

H01C 17/06586 ・・・・・{composed of organic material}

H01C 17/06593 ・・・・{characterised by the temporary binder}

H01C 17/07 ・・by resistor foil bonding, e.g. cladding

H01C 17/075 ・・by thin film techniques {(H01C 17/20 takes precedence)}

H01C 17/08 ・・・by vapour deposition

H01C 17/10 ・・・by flame spraying

H01C 17/12 ・・・by sputtering

H01C 17/14 ・・・by chemical deposition

H01C 17/16 ・・・・using electric current

H01C 17/18 ・・・・without using electric current

H01C 17/20 ・・by pyrolytic processes

H01C 17/22 ・adapted for trimming

H01C 17/23 ・・by opening or closing resistor geometric tracks of predetermined resistive values, {e.g. snapistors}

H01C 17/232 ・・Adjusting the temperature coefficient; Adjusting value of resistance by adjusting temperature coefficient of resistance

H01C 17/235 ・・Initial adjustment of potentiometer parts for calibration

H01C 17/24 ・・by removing or adding resistive material (H01C 17/23, H01C 17/232, H01C 17/235 take precedence)

H01C 17/2404 ・・・{by charged particle impact e.g. by electron or ion beam milling, sputtering, plasma etching}

H01C 17/2408 ・・・{by pulsed voltage erosion, e.g. spark erosion}

H01C 17/2412 ・・・{by electrolytic treatment e.g. electroplating (for anodic oxydation H01C 17/262)}

H01C 17/2416 ・・・{by chemical etching}

H01C 17/242 ・・・by laser {(trimming by laser in general B23K 26/0003)}

H01C 17/245 ・・・by mechanical means, e.g. sand blasting, cutting, ultrasonic treatment

H01C 17/26 ・・by converting resistive material

H01C 17/262 ・・・{by electrolytic treatment, e.g. anodic oxydation}

H01C 17/265 ・・・{by chemical or thermal treatment, e.g. oxydation, reduction, annealing (etching H01C 17/2416)}

H01C 17/267 ・・・・{by passage of voltage pulses or electric current}

H01C 17/28 ・adapted for applying terminals

H01C 17/281 ・・{by thick film techniques}

H01C 17/283 ・・・{Precursor compositions therefor, e.g. pastes, inks, glass frits}

H01C 17/285 ・・・・{applied to zinc or cadmium oxide resistors}

H01C 17/286 ・・・・{applied to TiO2 or titanate resistors}

H01C 17/288 ・・{by thin film techniques}

H01C 17/30 ・adapted for baking