WebCPC CPC COOPERATIVE PATENT CLASSIFICATION

B81B　MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g.

　　MICRO-MECHANICAL DEVICES (piezo-electric, electrostrictive or magnetostrictive elements per se H01L 41/00)

　　NOTE - This subclass does not cover:
　　- purely electrical or electronic devices per se which are covered by section H, e.g. subclass H01L;- purely optical devices per se which are covered by subclasses G02B or G02F;- essentially two-dimensional structures, e.g. layered products which are covered by subclass B32B;- chemical or biological structures per se which are covered by section C;- structures in atomic scale produced by manipulation of single atoms or molecules, which are covered by group B82B 1/00.

　　Devices or systems classified in this subclass are also classified in appropriate subclasses providing for their structural or functional features, if such features are of interest.

　　Attention is drawn to the following places:
A61K 9/50 Microcapsules for medicinal preparations B25J 7/00

　　Micromanipulators G02B 21/32 Micromanupulators combined with microscopes G11B 5/127 Magnetic heads H01P 3/08 Waveguide microstrips.

　　In this subclass, local "residual" subgroups, e.g. B81B 7/0077, are used with the following purpose:

　　When classifying a document which does not fit in any of a set of subgroups with the same dot-level, the document should be classified in the residual group, if present, and not in the group at the hierarchical level one dot above.

　　In the example, the document shall be classified in B81B 7/0077 and not in B81B 7/0032 as B81B 7/0077 is "residual" to B81B 7/0035-B81B 7/0074

B81B 1/00 Devices without movable or flexible elements, e.g. micro-capillary devices

B81B 1/002 ・{Holes characterised by their shape, in either longitudinal or sectional plane}

B81B 1/004 ・・{Through-holes, i.e. extending from one face to the other face of the wafer}

B81B 1/006 ・{Microdevices formed as a single homogeneous piece, i.e. wherein the mechanical function is obtained by the use of the device, e.g. cutters}

B81B 1/008 ・・{Microtips}

B81B 3/00 Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes (B81B 5/00 takes precedence)

B81B 3/0002 ・{Arrangements for avoiding sticking of the flexible or moving parts}

B81B 3/0005 ・・{Anti-stiction coatings}

B81B 3/0008 ・・{Structures for avoiding electrostatic attraction, e.g. avoiding charge accumulation}

B81B 3/001 ・・{Structures having a reduced contact area, e.g. with bumps or with a textured surface}

B81B 3/0013 ・・{Structures dimensioned for mechanical prevention of stiction, e.g. spring with increased stiffness}

B81B 3/0016 ・・{Arrangements for avoiding sticking of the flexible or moving parts not provided for in groups B81B 3/0005 to B81B 3/0013}

B81B 3/0018 ・{Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice-versa, i.e. actuators, sensors, generators}

B81B 3/0021 ・・{Transducers for transforming electrical into mechanical energy or vice versa (dynamo-electric machines H02K 57/00; electrostatic machines H02N 1/00; piezo-electric devices H01L 41/00)}

B81B 3/0024 ・・{Transducers for transforming thermal into mechanical energy or vice versa, e.g. thermal or bimorph actuators (electric motors using thermal effects H02N 10/00)}

B81B 3/0027 ・・{Structures for transforming mechanical energy, e.g. potential energy of a spring into translation, sound into translation}

B81B 3/0029 ・・{Transducers for transforming light into mechanical energy or viceversa}

B81B 3/0032 ・・{Structures for transforming energy not provided for in groups B81B 3/0021 to B81B 3/0029}

B81B 3/0035 ・{Constitution or structural means for controlling the movement of the flexible or deformable elements}

B81B 3/0037 ・・{For increasing stroke, i.e. achieve large displacement of actuated parts}

B81B 3/004 ・・{Angular deflection}

B81B 3/0043 ・・・{Increasing angular deflection}

B81B 3/0045 ・・・{Improve properties related to angular swinging, e.g. control resonance frequency}

B81B 3/0048 ・・・{Constitution or structural means for controlling angular deflection not provided for in groups B81B 3/0043 to B81B 3/0045}

B81B 3/0051 ・・[N: For defining the movement, i.e. structures that guide or limit the movement of an element (mechanical arrangements for preventing or damping vibration or shock H01H 3/60)

B81B 3/0054 ・・{For holding or placing an element in a given position}

B81B 3/0056 ・・{Adjusting the distance between two elements, at least one of them being movable, e.g. air-gap tuning}

B81B 3/0059 ・・{Constitution or structural means for controlling the movement not provided for in groups B81B 3/0037 to B81B 3/0056}

B81B 3/0062 ・{Devices moving in two or more dimensions, i.e. having special features which allow movement in more than one dimension}

B81B 3/0064 ・{Constitution or structural means for improving or controlling the physical properties of a device}

B81B 3/0067 ・・{Mechanical properties}

B81B 3/007 ・・・{For controlling stiffness, e.g. ribs}

B81B 3/0072 ・・・{For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers}

B81B 3/0075 ・・・{For improving wear resistance}

B81B 3/0078 ・・・{Constitution or structural means for improving mechanical properties not provided for in B81B 3/007 to B81B 3/0075}

B81B 3/0081 ・・{Thermal properties}

B81B 3/0083 ・・{Optical properties}

B81B 3/0086 ・・{Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage}

B81B 3/0089 ・・{Chemical or biological characteristics, e.g. layer which makes a surface chemically active}

B81B 3/0091 ・・{Magnetic properties, e.g. guiding magnetic flux}

B81B 3/0094 ・・{Constitution or structural means for improving or controlling physical properties not provided for in B81B 3/0067 to B81B 3/0091}

B81B 3/0097 ・[N: Devices comprising flexible or deformable elements not provided for in groups B81B 3/0002 to B81B 3/0094

B81B 5/00 Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements

B81B 7/00 Micro-structural systems; {Auxiliary parts of micro-structural devices or systems}

B81B 7/0003 ・{MEMS mechanisms for assembling automatically hinged components, self-assembly devices (self-assembly processes B81C 1/00007)}

B81B 7/0006 ・{Interconnects}

B81B 7/0009 ・{Structural features, others than packages, for protecting a device against environmental influences (B81C 1/00777 takes precedence)}

B81B 7/0012 ・・{Protection against reverse engineering, unauthorised use, use in unintended manner, wrong insertion or pin assignment}

B81B 7/0016 ・・{Protection against shocks or vibrations, e.g. vibration damping}

B81B 7/0019 ・・{Protection against thermal alteration or destruction (B81B 7/0083 takes precedence)}

B81B 7/0022 ・・{Protection against electrostatic discharge (electrostatic discharge protection for electronic semiconductor circuits H01L 27/0248; circuit arrangements for protecting electronic switching circuits used for pulse technique against overcurrent or overvoltage H03K 17/08)}

B81B 7/0025 ・・{Protection against chemical alteration}

B81B 7/0029 ・・{Protection against environmental influences not provided for in groups B81B 7/0012 to B81B 7/0025}

B81B 7/0032 ・{Packages or encapsulation (processes for packaging MEMS B81C 1/00261; packaging of smart-MEMS B81C 1/0023)}

B81B 7/0035 ・・{for maintaining a controlled atmosphere inside of the chamber containing the MEMS}

B81B 7/0038 ・・・{using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters}

B81B 7/0041 ・・・{maintaining a controlled atmosphere with techniques not provided for in B81B 7/0038}

B81B 7/0045 ・・{for reducing stress inside of the package structure}

B81B 7/0048 ・・・{between the MEMS die and the substrate}

B81B 7/0051 ・・・{between the package lid and the substrate}

B81B 7/0054 ・・・{between other parts not provided for in B81B 7/0048 to B81B 7/0051}

B81B 7/0058 ・・{for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations}

B81B 7/0061 ・・{suitable for fluid transfer from the MEMS out of the package or vice-versa, e.g. transfer of liquid, gas, sound}

B81B 7/0064 ・・{for protecting against electromagnetic or electrostatic interferences}

B81B 7/0067 ・・{for controlling the passage of optical signals through the package}

B81B 7/007 ・・{Interconnections between the MEMS and external electrical signals}

B81B 7/0074 ・・{3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board}

B81B 7/0077 ・・{Other packages not provided for in groups B81B 7/0035 to B81B 7/0074}

B81B 7/008 ・{MEMS characterised by an electronic circuit specially adapted for controlling or driving the same (B81B 7/0087 takes precedence; arrangements for starting, regulating, braking, or otherwise controlling an actuator H02N; control arrangements or circuits for visual indicators G09G 3/00)}

　　NOTE - This group covers:only MEMS with an electronic circuit which is not specific to a particular application. This group does not cover:electronic circuits per se, e.g. for controlling or driving application specific MEMS

B81B 7/0083 ・{Temperature control}

B81B 7/0087 ・・{On-device systems and sensors for controlling, regulating or monitoring}

B81B 7/009 ・・{Maintaining a constant temperature by heating or cooling}

B81B 7/0093 ・・・{by cooling}

B81B 7/0096 ・・・{by heating}

B81B 7/02 ・containing distinct electrical or optical devices of particular relevance for their function, e.g. micro-electro-mechanical systems (MEMS) (B81B 7/04 takes precedence)

B81B 7/04 ・Networks or arrays of similar micro-structural devices

B81B 2201/00 Specific applications of micro-electromechanical systems

B81B 2201/01 ・Switches

B81B 2201/012 ・・characterised by the shape

B81B 2201/014 ・・・having a cantilever fixed on one side connected to one or more dimples

B81B 2201/016 ・・・having a bridge fixed on two ends and connected to one or more dimples

B81B 2201/018 ・・・Switches not provided for in B81B 2201/014 to B81B 2201/016

B81B 2201/02 ・Sensors

B81B 2201/0207 ・・Bolometers

B81B 2201/0214 ・・Biosensors; Chemical sensors

B81B 2201/0221 ・・Variable capacitors

B81B 2201/0228 ・・Inertial sensors

B81B 2201/0235 ・・・Accelerometers

B81B 2201/0242 ・・・Gyroscopes

B81B 2201/025 ・・・Inertial sensors not provided for in B81B 2201/0235 to B81B 2201/0242

B81B 2201/0257 ・・Microphones or microspeakers

B81B 2201/0264 ・・Pressure sensors

B81B 2201/0271 ・・Resonators; ultrasonic resonators

B81B 2201/0278 ・・Temperature sensors

B81B 2201/0285 ・・Vibration sensors

B81B 2201/0292 ・・Sensors not provided for in B81B 2201/0207 to B81B 2201/0285

B81B 2201/03 ・Micro-engines and actuators

B81B 2201/031 ・・Thermal actuators

B81B 2201/032 ・・Bimorph and unimorph actuators, e.g. piezo and thermo

B81B 2201/033 ・・Comb drives

B81B 2201/034 ・・Electrical rotating micro-machines

B81B 2201/035 ・・Micro-gears

B81B 2201/036 ・・Micro-pumps

B81B 2201/037 ・・Micro-transmissions

B81B 2201/038 ・・Micro-engines and actuators not provided for in B81B 2201/031 to B81B 2201/037

B81B 2201/04 ・Optical MEMS

B81B 2201/042 ・・Micro-mirrors, not used as optical switches

B81B 2201/045 ・・Optical switches

B81B 2201/047 ・・Optical MEMS not provided for in B81B 2201/042 to B81B 2201/045

B81B 2201/05 ・Micro-fluidics

B81B 2201/051 ・・Micro-mixers, micro-reactors

B81B 2201/052 ・・Ink-jet print cartridges

B81B 2201/054 ・・Micro-valves

B81B 2201/055 ・・Micro-needles

B81B 2201/057 ・・Micropipets, dropformers

B81B 2201/058 ・・Micro-fluidics not provided for in B81B 2201/051 to B81B 2201/054

B81B 2201/06 ・Bio-MEMS

B81B 2201/07 ・Data storage devices, static or dynamic memories

B81B 2201/10 ・Micro-filters, e.g. for gas or fluids

B81B 2201/11 ・Read heads, write heads or micro-positioners for hard- or optical disks

B81B 2201/12 ・STM or AFM micro-tips

B81B 2201/13 ・Mechanical connectors, i.e. not functioning as an electrical connector

B81B 2203/00 Basic micro-electromechanical structures

B81B 2203/01 ・Suspended structures, i.e. structures allowing a movement

B81B 2203/0109 ・・Bridges

B81B 2203/0118 ・・Cantilevers

B81B 2203/0127 ・・Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function

B81B 2203/0136 ・・Comb structures

B81B 2203/0145 ・・Flexible holders

B81B 2203/0154 ・・・Torsion bars

B81B 2203/0163 ・・・Spring holders

B81B 2203/0172 ・・・Flexible holders not provided for in B81B 2203/0154 to B81B 2203/0163

B81B 2203/0181 ・・See-saws

B81B 2203/019 ・・characterized by their profile

B81B 2203/03 ・Static structures

B81B 2203/0307 ・・Anchors

B81B 2203/0315 ・・Cavities

B81B 2203/0323 ・・Grooves

B81B 2203/033 ・・・Trenches

B81B 2203/0338 ・・・Channels

B81B 2203/0346 ・・・Grooves not provided for in B81B 2203/033 to B81B 2203/0338

B81B 2203/0353 ・・Holes

B81B 2203/0361 ・・Tips, pillars

B81B 2203/0369 ・・characterized by their profile

B81B 2203/0376 ・・・rounded profile

B81B 2203/0384 ・・・sloped profile

B81B 2203/0392 ・・・profiles not provided for in B81B 2203/0376 to B81B 2203/0384

B81B 2203/04 ・Electrodes

B81B 2203/05 ・Type of movement

B81B 2203/051 ・・Translation according to an axis parallel to the substrate

B81B 2203/053 ・・Translation according to an axis perpendicular to the substrate

B81B 2203/055 ・・Translation in a plane parallel to the substrate, i.e. enabling movement along any direction in the plane

B81B 2203/056 ・・Rotation in a plane parallel to the substrate

B81B 2203/058 ・・Rotation out of a plane parallel to the substrate

B81B 2203/06 ・Devices comprising elements which are movable in relation to each other, e.g. slidable or rotatable

B81B 2207/00 Micro-structural systems or auxiliary parts thereof

B81B 2207/01 ・comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS

B81B 2207/012 ・・the micromechanical device and the control or processing electronics being separate parts in the same package

B81B 2207/015 ・・the micromechanical device and the control or processing electronics being integrated on the same substrate

B81B 2207/017 ・・Smart-MEMS not provided for in B81B 2207/012 to B81B 2207/015

B81B 2207/03 ・Electronic circuits for micro-mechanical devices which are not application specific, e.g. for controlling, power supplying, testing, protecting.

B81B 2207/05 ・Arrays

B81B 2207/053 ・・of movable structures

B81B 2207/056 ・・of static structures

B81B 2207/07 ・Interconnects

B81B 2207/09 ・Packages

B81B 2207/091 ・・Arrangements for connecting external electrical signals to mechanical structures inside the package

B81B 2207/092 ・・・Buried interconnects in the substrate or in the lid

B81B 2207/093 ・・・Conductive package seal

B81B 2207/094 ・・・Feed-through, via

B81B 2207/095 ・・・・through the lid

B81B 2207/096 ・・・・through the substrate

B81B 2207/097 ・・・Interconnects arranged on the substrate or the lid, and covered by the package seal

B81B 2207/098 ・・・Arrangements not provided for in groups B81B 2207/092 to B81B 2207/097

B81B 2207/11 ・Structural features, others than packages, for protecting a device against environmental influences

B81B 2207/115 ・・Protective layers applied directly to the device before packaging

B81B 2207/99 ・Micro-structural systems or auxiliary parts thereof not provided for in B81B 2207/01 to B81B 2207/115

--- Edited by Muguruma Professional Engineer Office(C), 2013 ---