WebCPC CPC COOPERATIVE PATENT CLASSIFICATION
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING (decorating textiles by metallising D06Q 1/04; manufacturing printed circuits by metal deposition H05K 3/18); APPARATUS THEREFOR
WARNING - The following IPC groups are not used in the CPC system. Subject matter covered by these groups is classified in the following CPC groups :C25D 5/24 covered byC25D 1/00 Electroforming
C25D 1/003 ・{3D structures, e.g. superposed patterned layers}
C25D 1/006 ・{Nanostructures, e.g. aluminum anodic oxidation templates [AAO]}
C25D 1/02 ・Tubes; Rings; Hollow bodies
C25D 1/04 ・Wires;Strips; Foils
C25D 1/06 ・Wholly-metallic mirrors
C25D 1/08 ・Perforated or foraminous objects, e.g. sieves (C25D 1/10 takes precedence)
C25D 1/10 ・Moulds; Masks; Masterforms {, e.g. mandrels, stampers}
C25D 1/12 ・by electrophoresis {(electrophoretic coating C25D 13/00)}
C25D 1/14 ・・of inorganic material
C25D 1/16 ・・・Metals
C25D 1/18 ・・of organic material
C25D 1/20 ・Separation of the formed objects from the electrodes {with no destruction of said electrodes}
C25D 1/22 ・・Separating compounds
C25D 3/00 Electroplating: Baths therefor
C25D 3/02 ・from solutions (C25D 5/24 to C25D 5/32 take precedence)
C25D 3/04 ・・of chromium
C25D 3/06 ・・・from solutions of trivalent chromium
C25D 3/08 ・・・Deposition of black chromium {, e.g. hexavalent chromium, CrVI}
C25D 3/10 ・・・characterised by the organic bath constituents used
C25D 3/12 ・・of nickel or cobalt {(C25D 3/56 takes precedence)}
C25D 3/14 ・・・from baths containing acetylenic or heterocyclic compounds
C25D 3/16 ・・・・Acetylenic compounds
C25D 3/18 ・・・・Heterocyclic compounds
C25D 3/20 ・・of iron
C25D 3/22 ・・of zinc
C25D 3/24 ・・・from cyanide baths
C25D 3/26 ・・of cadmium
C25D 3/28 ・・・from cyanide baths
C25D 3/30 ・・of tin
C25D 3/32 ・・・characterised by the organic bath constituents used
C25D 3/34 ・・of lead
C25D 3/36 ・・・characterised by the organic bath constituents used
C25D 3/38 ・・of copper
C25D 3/40 ・・・from cyanide baths {, e.g. with Cu+}
C25D 3/42 ・・of light metals
C25D 3/44 ・・・Aluminium
C25D 3/46 ・・of silver
C25D 3/48 ・・of gold
C25D 3/50 ・・of platinum group metals
C25D 3/52 ・・・characterised by the organic bath constituents used
C25D 3/54 ・・of metals not provided for in groups C25D 3/04 to C25D 3/50
C25D 3/56 ・・of alloys
C25D 3/562 ・・・{containing more than 50% by weight of iron or nickel or cobalt {; NiP, FeP, CoP (Phosphatising C25D 11/36)}}
C25D 3/565 ・・・{containing more than 50% by weight of zinc}
C25D 3/567 ・・・{containing more than 50% by weight of platinum group metals}
C25D 3/58 ・・・containing more than 50% by weight of copper
C25D 3/60 ・・・containing more than 50% by weight of of tin {; SnP}
C25D 3/62 ・・・containing more than 50% by weight of gold
C25D 3/64 ・・・containing more than 50% by weight of silver
C25D 3/66 ・from melts
C25D 3/665 ・・{from ionic liquids}
WARNING - Group C25D 3/665 is not complete, pending reorganization, see also C25D 3/66]C25D 5/00 Electroplating characterised by the process; Pretreatment or after-treatment of work-pieces
C25D 5/003 ・{Electroplating characterised by the use of gases, e.g. pressure influence (removal or gases or vapours, C25D 21/04)}
WARNING - Groups C25D 5/00B, C25D 5/006 are not complete, pending reorganization, see also C25D 5/00C25D 5/006 ・{Electroplating with applied electromagnetic field, not locally , e.g. for plating magnetic layers}
C25D 5/02 ・Electroplating of selected surface areas
C25D 5/022 ・・{using masking means {(C25D 11/022 takes precedence)}}
C25D 5/024 ・・{using locally applied electromagnetic radiation e.g. lasers}
C25D 5/026 ・・{using locally applied jets of electrolyte}
C25D 5/028 ・・{one side electroplating {, e.g. substrate conveyed in a bath with inhibited background plating}}
C25D 5/04 ・Electroplating with moving electrodes
C25D 5/06 ・・Brush or pad plating {(electrodes for pad plating C25D 17/14)}
C25D 5/08 ・Electroplating with moving electrolyte {, characterised by electrolyte flow}, e.g. jet electroplating {(spraying of electrolyte on wires strip or foils C25D 7/0642, means or devices for moving the electrolyte C25D 21/10, C25D 5/026 takes precedence)}
C25D 5/10 ・Electroplating with more than one layer of the same or of different metals (for bearings C25D 7/10)
C25D 5/12 ・・at least one layer being of nickel or chromium
C25D 5/14 ・・・two or more layers being of nickel or chromium, e.g. duplex or triplex layers
C25D 5/16 ・Electroplating with layers of varying thickness {, e.g. rough surfaces}{; Hull cells}
C25D 5/18 ・Electroplating using modulated, pulsed or reversing current
C25D 5/20 ・Electroplating using ultrasonics {, vibrations}
C25D 5/22 ・Electroplating combined with mechanical treatment during the deposition
C25D 5/34 ・Pretreatment of metallic surfaces to be electroplated
C25D 5/36 ・・of iron or steel
C25D 5/38 ・・of refractory metals or nickel
C25D 5/40 ・・・Nickel; Chromium
C25D 5/42 ・・of light metals
C25D 5/44 ・・・Aluminium
C25D 5/46 ・・of actinides
C25D 5/48 ・After-treatment of electroplated surfaces
C25D 5/50 ・・by heat-treatment
C25D 5/505 ・・・{of electroplated tin coatings, e.g. by melting}
C25D 5/52 ・・by brightening or burnishing
C25D 5/54 ・Electroplating {on } non-metallic surfaces {,e.g. on carbon or carbon composites}(C25D 7/12 takes precedence)
C25D 5/56 ・・on {thin or conductive} plastics {(coating metallic material C23C)}
C25D 7/00 Electroplating characterised by the article coated
C25D 7/001 ・{Magnets}
WARNING - Groups C25D 7/00B-C25D 7/008 are not complete, pending reorganization, see also C25D 7/00C25D 7/003 ・{Threaded pieces, e.g. bolts, nuts}
C25D 7/005 ・{Jewels or clockworks}
C25D 7/006 ・{Nanoparticles}
C25D 7/008 ・{Thermal barrier coatings}
C25D 7/02 ・Slide fasteners
C25D 7/04 ・Tubes; Rings; Hollow bodies
C25D 7/06 ・Wires; Strips; Foils
C25D 7/0607 ・・{Wires}
C25D 7/0614 ・・{Strips or foils}
C25D 7/0621 ・・・{In horizontal cells}
C25D 7/0628 ・・・{In vertical cells}
C25D 7/0635 ・・・{In radial cells}
C25D 7/0642 ・・・{Anodes}
C25D 7/065 ・・・{Diaphragms}
C25D 7/0657 ・・・{Conducting rolls}
C25D 7/0664 ・・・{Isolating rolls}
C25D 7/0671 ・・・{Selective plating}
C25D 7/0678 ・・・・{using masks}
C25D 7/0685 ・・・{Spraying of electrolyte}
C25D 7/0692 ・・・{Regulating the thickness of the coating}
C25D 7/08 ・Mirrors; Reflectors
C25D 7/10 ・Bearings
C25D 7/12 ・Semiconductors {without seed layer}
C25D 7/123 ・・{Semiconductors first coated with a seed layer for filling vias}
WARNING - Groups C25D 7/12B-C25D 7/126 are not complete, pending reorganization, see also C25D 7/12]C25D 7/126 ・・{Semiconductors first coated with a seed layer for solar cells}
C25D 9/00 Electrolytic coating other than with metals (C25D 11/00, C25D 15/00 take precedence; electrophoretic coating C25D 13/00)
C25D 9/02 ・with organic materials
C25D 9/04 ・with inorganic materials
C25D 9/06 ・・by anodic processes
C25D 9/08 ・・by cathodic processes
C25D 9/10 ・・・on iron or steel
C25D 9/12 ・・・on light metals
C25D 11/00 Electrolytic coating by surface reaction, i.e. forming conversion layers
C25D 11/005 ・{Apparatus specially adapted for electrolytic conversion coating (apparatus in general for electrolytic coating C25D 17/00)}
WARNING - Groups C25B 11/00B, C25D 11/022-C25D 11/02F, C25D 11/045 are not complete, pending reorganization, see also C25D 11/00C25D 11/02 ・Anodisation
C25D 11/022 ・・{Anodisation on selected surface areas}
C25D 11/024 ・・{Anodisation under pulsed or modulated current or potential}
C25D 11/026 ・・{Anodisation with spark discharge [ANOF]}
C25D 11/028 ・・{Borodising,, i.e. borides formed electrochemically}
C25D 11/04 ・・of aluminium or alloys based thereon
C25D 11/045 ・・・{for forming AAO templates}
C25D 11/06 ・・・characterised by the electrolytes used
C25D 11/08 ・・・・containing inorganic acids
C25D 11/10 ・・・・containing organic acids
C25D 11/12 ・・・Anodising more than once, e.g. in different baths
C25D 11/14 ・・・Producing integrally coloured layers
C25D 11/16 ・・・Pretreatment {, e.g. desmutting}
C25D 11/18 ・・・After-treatment, e.g. pore sealing (lacquering B44D)
C25D 11/20 ・・・・Electrolytic after-treatment
C25D 11/22 ・・・・・for colouring layers
C25D 11/24 ・・・・Chemical after-treatment
C25D 11/243 ・・・・・{using organic dyestuffs}
C25D 11/246 ・・・・・{for sealing layers}
C25D 11/26 ・・of refractory metals or alloys based thereon
C25D 11/28 ・・of actinides or alloys based thereon
C25D 11/30 ・・of magnesium or alloys based thereon
C25D 11/32 ・・of semiconducting materials
C25D 11/34 ・・of metals or alloys not provided for in groups C25D 11/04 to C25D 11/32
C25D 11/36 ・Phosphatising {, e.g. NiP, CoP, FeP (bath solutions of NiP, CoP, FeP C25D 3/562)}
C25D 11/38 ・Chromatising
C25D 13/00 Electrophoretic coating (C25D 15/00 takes precedence; apparatus for continuously conveying articles into baths B65G, e.g. B65G 49/00)
C25D 13/02 ・with inorganic material
C25D 13/04 ・with organic material
C25D 13/06 ・・with polymers {not used, see C09D 5/44}
C25D 13/08 ・・・by polymerisation in situ of monomeric materials {not used, see C09D 5/4476}
C25D 13/10 ・characterised by the additives used{not used, see C09D 5/448}
C25D 13/12 ・characterised by the article coated
C25D 13/14 ・・Tubes; Rings; Hollow bodies
C25D 13/16 ・・Wires; Strips; Foils
C25D 13/18 ・using modulated, pulsed, or reversing current
C25D 13/20 ・Pre-treatment
C25D 13/22 ・Servicing or operating {apparatus or multistep processes}
C25D 13/24 ・・Regeneration of process liquids
C25D 15/00 Electrolytic or electrophoretic production of coatings containing {uncharged} embedded materials, e.g. particles, whiskers, wires
C25D 15/02 ・Combined electrolytic and electrophoretic processes {with charged materials}
C25D 17/00 Constructional parts, or assemblies thereof, of cells for electrolytic coating (apparatus for continuously conveying articles into baths B65G, e.g. B65G 49/00; electric devices see the relevant classes, e.g. H01B, H02G){(C25D 7/06, C25D 11/42, C25D 13/22, C25 takes precedence)}
C25D 17/001 ・{Apparatus specially adapted for plating wafers, e.g. semiconductors, solar cells}
WARNING - Groups C25B 17/00B-C25D 17/008 are not complete, pending reorganization, see also C25D 17/00C25D 17/002 ・{Cell separation, e.g. membranes, diaphragms}
C25D 17/004 ・{Sealing devices}
C25D 17/005 ・{Contacting devices}
C25D 17/007 ・{Current conducting devices}
C25D 17/008 ・{Current insulating devices}
C25D 17/02 ・Tanks; Installations therefor
C25D 17/04 ・・External supporting frames or structures
C25D 17/06 ・Suspending or supporting devices for articles to be coated
C25D 17/08 ・・{Supporting} racks{i.e. not for suspending}
C25D 17/10 ・Electrodes {e.g. composition, counter electrode}
C25D 17/12 ・・Shape or form (C25D 17/14 takes precedence)
C25D 17/14 ・・for pad-plating
C25D 17/16 ・Apparatus for electrolytic coating of small objects in bulk
C25D 17/18 ・・having closed containers
C25D 17/20 ・・・Horizontal barrels
C25D 17/22 ・・having open containers
C25D 17/24 ・・・Oblique barrels
C25D 17/26 ・・・Oscillating baskets
C25D 17/28 ・・with means for moving the objects individually through the apparatus during treatment
C25D 21/00 Processes for servicing or operating cells for electrolytic coating
C25D 21/02 ・Heating or cooling
C25D 21/04 ・Removal of gases or vapours {; gas or pressure control (electroplating characterized by the use of gases C25D 5/003)}
C25D 21/06 ・Filtering {particles other than ions (filtering ions C25D 21/22)}
C25D 21/08 ・Rinsing
C25D 21/10 ・Agitating of electrolytes; Moving of racks
C25D 21/11 ・Use of protective surface layers on electrolytic baths
C25D 21/12 ・Process control or regulation (controlling or regulating in general G05)
C25D 21/14 ・・Controlled addition of electrolyte components
C25D 21/16 ・Regeneration of process solutions {(C25D 13/24 takes precedence)}
C25D 21/18 ・・of electrolytes (C25D 21/22 takes precedence)
C25D 21/20 ・・of rinse-solutions (C25D 21/22 takes precedence)
C25D 21/22 ・・by ion-exchange
--- Edited by Muguruma Professional Engineer Office(C), 2013 ---